Recently, West Lake Instruments officially released the high-efficiency laser stripping technology for large-size single-crystal diamonds, achieving multiple breakthroughs in key technical indicators such as process efficiency, material loss control and processing stability, providing core equipment support for the industrial application of diamond, the "ultimate semiconductor material", marking its phased lead in the new generation of semiconductor material processing.
The laser stripping technology released by West Lake Instruments this time uses an advanced femtosecond laser system to focus on the inside of the diamond crystal to form a controllable graphite modification layer, and achieves efficient material separation through annealing or electrochemical methods, significantly reducing losses and shortening processing cycles. Taking a 1-inch crystal as an example, this technology has an order of magnitude improvement in efficiency and yield compared to traditional laser cutting, and the compatible size can reach 14 inches, with good magnification and mass production adaptability.
At the process technology level, West Lake Instruments focuses on cutting-edge directions such as femtosecond laser processing, ice-engraved micro-nanostructure processing, and multifunctional microscopic spectral analysis, and continues to promote the integration of "superhard materials + ultrafast laser" technology. The femtosecond laser stripping process developed by it is not only applicable to diamond materials, but can also be extended to third-generation/fourth-generation semiconductor materials such as silicon carbide, gallium nitride, and sapphire, with wide material adaptability and cross-industry application potential.
In addition, the non-thermal processing characteristics of this technology significantly reduce crystal structure damage and surface stress accumulation, and can achieve high-precision microstructure construction without destroying the integrity of the crystal, which is suitable for high-end fields such as high-power devices and deep ultraviolet devices.
